Sealed header and method of making

Details Sealed header and method of making Sealed header and method of making

2003-11-14

2009-02-17

Bui, Hung S (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S800000

Reexamination Certificate

active

07492600

ABSTRACT:
An electronic module (2) comprises casing4, and header6with a printed circuit board10positioned within a cavity26of casing4. Connector6includes terminals8, which allow for electrical connection for a mating connector, but also include compliant portions54which form the mechanical and electrical connector to printed circuit board10. Compliant portions54together with an adhesive62provide for the bonded connection between header6and printed circuit board10. Gasket60further provides a peripheral seal between casing4and header6.

REFERENCES:
patent: 5181855 (1993-01-01), Mosquera et al.
patent: 5340334 (1994-08-01), Nguyen
patent: 5998738 (1999-12-01), Li et al.
patent: 6139373 (2000-10-01), Ward et al.
patent: 6606252 (2003-08-01), Snider
patent: 6616480 (2003-09-01), Kameyama
patent: 6652292 (2003-11-01), Pratt et al.
patent: 6683789 (2004-01-01), Sheynis et al.
patent: 7125285 (2006-10-01), Maejima et al.
patent: 7210969 (2007-05-01), Hashimoto et al.
patent: 2003/0049972 (2003-03-01), Aoki
patent: 2003/0161110 (2003-08-01), Spasevski et al.

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