Sealed electronic package providing in-situ metallization

Details Sealed electronic package providing in-situ metallization Sealed electronic package providing in-situ metallization

1992-02-14

1993-08-10

Broome, Harold

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

310312, 20429811, H05K 506, H01L 4104

Patent

active

052351351

ABSTRACT:
In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by means of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter.

REFERENCES:
patent: 2808523 (1957-10-01), Holmbeck
patent: 3006711 (1961-10-01), Silver
patent: 3028262 (1962-04-01), Klingsporn
patent: 4391034 (1983-07-01), Stuby
patent: 4410407 (1993-10-01), Macaulay
patent: 4849079 (1989-07-01), Cuomo et al.

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