Sealed electronic module with fastenerless circuit board...

Details Sealed electronic module with fastenerless circuit board... Sealed electronic module with fastenerless circuit board...

2006-05-23

2006-05-23

Harvey, James R. (Department: 2833)

Electrical connectors

With sealing element or material for cooperation with...

Including chamber for contact potting

C361S742000, C361S758000

Reexamination Certificate

active

07048564

ABSTRACT:
A sealed electronic module includes a housing having an open end and a circuit board that is both peripherally and centrally supported within the housing, where potting material applied to the exposed face of the circuit board peripherally and centrally affixes the circuit board to the housing and also environmentally seals the module. The central support for the circuit board is provided by a support post that is integral with the housing. A reduced size tip of the support post extends through an opening formed in a central area of the circuit board, and potting material applied to the exposed face of the circuit board for sealing the module also flows into the circuit board opening around the tip of the support post. The cured potting material structurally bonds the periphery of the circuit board to the housing walls and the central area of the circuit board to the housing support post.

REFERENCES:
patent: 4526432 (1985-07-01), Cronin et al.
patent: 5703754 (1997-12-01), Hinze
patent: 6259032 (2001-07-01), Fernandez
patent: 6262887 (2001-07-01), Lee
patent: 6768648 (2004-07-01), Kobayashi
patent: 6821130 (2004-11-01), Danley
patent: 6850418 (2005-02-01), Dutton et al.
patent: 2003/0017735 (2003-01-01), Singh
patent: 2004/0057217 (2004-03-01), Dutton et al.

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