Sealed conductive active alloy feedthroughs

Details Sealed conductive active alloy feedthroughs Sealed conductive active alloy feedthroughs

1992-08-04

1994-11-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

174 5061, 174263, 174265, H01B 1726, B23K 3530, B23K10138

Patent

active

053682203

ABSTRACT:
A method of manufacturing a hermetically sealed conductive feedthrough, particularly for use in ceramic substrates or housing, comprises the steps of inserting an active alloy containing preform into a predetermined insertion hole in a presintered ceramic article and heating the assembly to a temperature to achieve a brazing reaction at the interface of the article and active alloy to produce a hermetically sealed conductive feedthrough. The invention further discloses a non-melting connector pin which may be fixed to the active alloy feedthrough during the above heating step.

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