Sealed and pressurized liquid cooling system for microprocessor

Details Sealed and pressurized liquid cooling system for microprocessor Sealed and pressurized liquid cooling system for microprocessor

2002-12-27

2004-10-26

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C165S104260, C361S702000, C361S701000, C361S697000

Reexamination Certificate

active

06809928

ABSTRACT:

BACKGROUND
As microprocessors increase in size and complexity, increased demands are placed on heat sink arrangements for microprocessors. Consequently, liquid-based heat sink arrangements have been proposed, including a cold plate mounted to serve as a heat sink with a coolant liquid flowing through the cold plate.
Conventional liquid-based cooling systems for microprocessors suffer from a number of disadvantages. For example, conventional liquid-based cooling systems may require servicing and may not perform reliably throughout a desired useful life of the computers in which such cooling systems are installed.


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US 2003/017876 A1 “System And Method For Providing Cooling System With Heat Exchangers” Jenkins et al Sep. 25, 2003.*
“PCT International Searching Authority—Partial International Search Report”, dated Jun. 1, 2004 for PCTUS03/39193, 6pgs.

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