Sealant method of epoxy resin-clay composites

Details Sealant method of epoxy resin-clay composites Sealant method of epoxy resin-clay composites

1996-09-13

1998-06-02

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523216, 523443, C08K 334, C08K 904, C08L 300

Patent

active

057601062

ABSTRACT:
A clay-resin composition of a cured epoxy resin and a layered clay with the cured epoxy resin in the galleries of the clay by intercalation or exfoliation. The preferred epoxy resins are flexible and usually elastic because of the epoxy resin and/or curing agent which is used. The result is a composite which can have superior tensile strength and/or solvent resistance as compared to the cured epoxy resin without the clay or with the clay but without the intercalation or exfoliation. The flexible composites are particularly useful for seals and other thin layer applications.

REFERENCES:
patent: 3432370 (1969-03-01), Bash et al.
patent: 3511725 (1970-05-01), Stevens et al.
patent: 3847726 (1974-11-01), Becker et al.
patent: 4683259 (1987-07-01), Goodman
patent: 4889885 (1989-12-01), Usuki et al.
patent: 5108832 (1992-04-01), Nugent, Jr. et al.
patent: 5554670 (1996-09-01), Giannelis et al.
Giannelis, E.P. Jom 44 28 (1992).
Gleiter, H. Adv. Mater. 4 474 (1992).
Novak, B. M., Adv. Mater. 5 422 (1993).
Pinnavaia, T.J., Science 220 365 (1983).
Kato, C., et al., Clays Clay Miner, 27 129 (1979).
Sugahara, Y., et al., J. Ceram. Soc. JPN. 100 413 (1992).
Vaia, R.A., et al., Chem. Mater. 5 1694 (1993).
Messersmith, P.B., et al., Chem. Mater. 5 1064 (1993).
Fukushima, Y., et al., J. Inclusion Phenom. 5 473 (1987).
Fukushima, Y., et al., Clay Miner 23 27 (1988).
Usuki, A., et al., J. Mater. Res. 8 1174 (1993).
Usuki, A., et al., J. Mater. Res. 8 1179 (1993).
Kojima, Y., et al, J. Mater. Res. Res. 8 1185 (1993).
Kirk-Othmer, John Wiley & sons 9 267-290 (1980).
Kamon, T., et al., In Epoxy Resins and Composites IV, Dusek, K., Ed. Springer-Verlag: Berlin: Advances in Polymer Science, 80 177 (1986).
Barton, J. M., Advances in Polymer Science 72 120 (1985).
May, C.A., Ed. Epoxy Resins, 2nd ed: Marcel Dekker: New York (1988) pp. 285-309.
Lan, et al., Proceedings of the ACS, PMSE 71 527-528 (published Aug. 1994).
Lan et al., Chemistry of Materials 6 2216-2219 (Dec. 1994).
Messersmithet al., Chemical Materials 6 1719-1725 (Dec. 1994).

Affiliated with

Also associated with

Rating

Sealant method of epoxy resin-clay composites does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealant method of epoxy resin-clay composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealant method of epoxy resin-clay composites will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1460496