Sealant

Compositions – Electrically conductive or emissive compositions

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

252511, 252512, 252518, 521 89, 521 92, 521139, 524505, 525216, H01B 122

Patent

active

049784749

ABSTRACT:
The present invention discloses a heat pumpable expandable weld through sealant comprising a combination of a terpolymer and a copolymer, a curing agent, electrically conductive particles and a blowing agent. Also disclosed is a method of bonding two metal components using this sealant.

REFERENCES:
patent: 1947894 (1934-02-01), Whitworth
patent: 2347172 (1944-04-01), Cox
patent: 2452805 (1948-11-01), Sussenbach
patent: 2510727 (1950-06-01), Sussenbach
patent: 2666835 (1954-01-01), Elleman
patent: 2806509 (1957-09-01), Bozzacco et al.
patent: 2909643 (1959-10-01), Graves, Jr.
patent: 3214564 (1965-10-01), Katzer et al.
patent: 3230290 (1966-01-01), Nelson et al.
patent: 3277268 (1966-10-01), Williams et al.
patent: 3401253 (1968-09-01), Foster
patent: 3437783 (1969-04-01), Lemelson
patent: 3558422 (1971-01-01), Hamilton
patent: 3602682 (1971-08-01), Hoeffleur
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3855044 (1974-12-01), Riel
patent: 3875434 (1975-04-01), Harden et al.
patent: 4195215 (1980-03-01), Clarke
patent: 4680316 (1987-07-01), Douglas

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sealant does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealant will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1424434

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.