Sealable packaging structures and applications related thereto

Details Sealable packaging structures and applications related thereto Sealable packaging structures and applications related thereto

2006-09-15

2011-10-25

Dye, Rena (Department: 1782)

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

C428S035200, C428S034300, C428S035800, C428S036100

Reexamination Certificate

active

08043674

ABSTRACT:
Heat-sealable, multi-layer composite packaging structures that are suitable for packaging and having improved sealing properties and simplified construction as compared to prior art composite film constructions are disclosed. The inventive film structure includes a first substrate, such as paper, bonded such as by extrusion lamination, to a sealable, high-barrier film. This inventive “paper-adhesive-polymer” lamination may replace prior art “paper-adhesive-foil-adhesive” foil-based tandem laminations. An improved or comparable polymer film substrate may replace the “foil-adhesive” layer components of the popular incumbent prior art structure.

REFERENCES:
patent: 3120335 (1964-02-01), Egleston et al.
patent: 5888648 (1999-03-01), Donovan et al.
patent: 6326068 (2001-12-01), Kong et al.
patent: 6528173 (2003-03-01), Buzio et al.
patent: 6534137 (2003-03-01), Vadhar
patent: 6624247 (2003-09-01), Kume et al.
patent: 6641913 (2003-11-01), Hanyu et al.
patent: 2002/0164470 (2002-11-01), Bader
patent: 2003/0211298 (2003-11-01), Migliorini et al.
patent: 2004/0067288 (2004-04-01), Wu et al.
patent: 2005/0238874 (2005-10-01), Pellingra et al.
patent: 1283242 (2003-02-01), None
patent: 1543956 (2005-06-01), None
patent: WO 2005/097492 (2005-10-01), None
U.S. Appl. No. 11/248,838, filed Oct. 12, 2005, entitled “Multi-Layer Films, Methods of Manufacture and Articles Made Therefrom”, Inventors: Keung et al.
USSN: Not Yet Assigned, filed Sep. 15, 2006, entitled “Polymer Films and Methods of Producing and Using Such Films”, Inventors: Rehkugler et al.

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