Sealable electronics packages and methods of producing and seali

Details Sealable electronics packages and methods of producing and seali Sealable electronics packages and methods of producing and seali

1994-06-02

1995-07-18

Lin, Kuang Y.

Metal founding

Process

Shaping liquid metal against a forming surface

164 98, B22D 1914, B22D 1904

Patent

active

054332605

ABSTRACT:
Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The methods and apparatus of the present inventions are especially suitable for hermetically sealing metal matrix composite electronics packages.

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