Sealable electronics packages

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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174 5061, H01J 532

Patent

active

056751222

ABSTRACT:
Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.

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patent: 3726987 (1973-04-01), Pryor et al.
patent: 4788382 (1988-11-01), Ahearn et al.
patent: 5104755 (1992-04-01), Taylor et al.
patent: 5175067 (1992-12-01), Taylor et al.
patent: 5227250 (1993-07-01), Bobal et al.
patent: 5368220 (1994-11-01), Mizuhara et al.

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