Seal structure for tape carrier package

Details Seal structure for tape carrier package Seal structure for tape carrier package

1995-07-06

1998-09-29

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257668, 257687, 257778, 257787, H01L 2312, H01L 23495, H01L 2328, H01L 2352

Patent

active

058148825

ABSTRACT:
An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting portions between the inner leads and the pads of the LSI chip are sealed by casting a plastic seal. The plastic seal extends over the back side of the organic insulative film. The projected portion of the plastic seal at the back side of the organic insulative film is covered with a moisture-proofing seal member to provide more inexpensive than transfer molding and highly reliable seal structure for a tape carrier package.

REFERENCES:
patent: 4649418 (1987-03-01), Uden
patent: 5016084 (1991-05-01), Nakao
patent: 5083191 (1992-01-01), Ueda
patent: 5357400 (1994-10-01), Takekawa
patent: 5390079 (1995-02-01), Aomori et al.
patent: 5404273 (1995-04-01), Akagawa
patent: 5442232 (1995-08-01), Goto et al.

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