Seal ring in semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE23002

Reexamination Certificate

active

07602065

ABSTRACT:
A semiconductor device includes a first circuit, a first seal ring and at least one first notch. The first seal ring surrounds the first circuit. The first notch cuts the first seal ring. Specifically, the first notch includes an inner opening, an outer opening and a connecting groove. The inner opening is located on the inner side of the first seal ring. The outer opening is located on the outer side of the first seal ring. The outer opening and the inner opening are not aligned. The connecting groove connects the inner opening and the outer opening.

REFERENCES:
patent: 2004/0069227 (2004-04-01), Ku et al.
patent: 2006/0267155 (2006-11-01), Ohsumi
patent: 2009/0014867 (2009-01-01), Krawiec

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Seal ring in semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Seal ring in semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Seal ring in semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4117298

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.