Seal ring for mixed circuitry semiconductor devices

Details Seal ring for mixed circuitry semiconductor devices Seal ring for mixed circuitry semiconductor devices

2006-08-31

2009-02-03

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C257S620000, C257SE21523

Reexamination Certificate

active

07485549

ABSTRACT:
In mixed-component, mixed-signal, semiconductor devices, selective seal ring isolation from the substrate and its electrical potential is provided in order to segregate noise sensitive circuitry from electrical noise generated by electrically noisy circuitry. Appropriate predetermined sections of such a mixed use chip are isolated from the substrate through a non-ohmic contact with the substrate without compromising reliability of the chip's isolation from scribe region contamination.

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patent: 6879023 (2005-04-01), Gutierrez
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