Scribing tool and method

Details Scribing tool and method Scribing tool and method

2008-07-01

2008-07-01

Ashley, Boyer D. (Department: 3724)

Cutting

Other than completely through work thickness or through work...

Scoring

C083S879000, C083S886000, C438S460000

Reexamination Certificate

active

07392732

ABSTRACT:
A scribing tool for use in semiconductor scribing apparatus includes a rotatable semiconductor wafer scribing wheel engageable with the semiconductor wafer to form a scribe line when the tool exerts pressure on the semiconductor wafer and the scribing wheel rotates. Bearings are engageable with the scribing wheel sides to resist sideways deflection during the scribing operation.

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