Scribing system with particle remover

Details Scribing system with particle remover Scribing system with particle remover

2006-01-05

2008-08-26

Ashley, Boyer D. (Department: 3724)

Cutting

Other than completely through work thickness or through work...

Scoring

C083S879000, C083S886000, C083S663000, C083S676000

Reexamination Certificate

active

07415916

ABSTRACT:
Particle removal structure is employed with a scribing tool to remove particles from the surface of a semiconductor wafer being scribed and transport the particles to another location.

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