Scribed interleaf separator wafer packaging

Details Scribed interleaf separator wafer packaging Scribed interleaf separator wafer packaging

2005-08-23

2005-08-23

Chaudhuri, Olik (Department: 2823)

Stock material or miscellaneous articles

Circular sheet or circular blank

C206S710000, C428S167000

Reexamination Certificate

active

06933033

ABSTRACT:
A separator of semiconductor wafers is made from polyethylene with a dissipative material and includes a first and second set of embossed cut perpendicular lines. The first set is typically parallel to the second set, and each set includes pairs of cut lines which are spaced from adjacent pairs. The depth of grid lines cut into the material allows air flow, circulation and vacuum release.

REFERENCES:
patent: 5091229 (1992-02-01), Golike et al.
patent: 5183699 (1993-02-01), Takemura et al.
patent: 6533123 (2003-03-01), Nakamura et al.
patent: 2002/0014435 (2002-02-01), Bores et al.
patent: 2003/0056471 (2003-03-01), Linker et al.
patent: 2004/0048028 (2004-03-01), Thomas et al.
patent: 2004/0146690 (2004-07-01), Vermillion

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