Screenable contact structure and method for semiconductor device

Compositions – Electrically conductive or emissive compositions

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252512, 252513, 252514, 106 112, 106 113, 106 114, 106 116, 106 117, 106 118, 106 119, 29875, 29885, 75252, 75255, H01B 100, H01B 513

Patent

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042194482

ABSTRACT:
An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, and a metal frit. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. The sintering process typically may be carried out in any type of atmosphere. A small amount of dopant or semiconductor material may be added to the ink systems to achieve particular results if desired.

REFERENCES:
patent: 3410722 (1968-11-01), Flanders et al.
patent: 3684533 (1972-08-01), Conwicke
patent: 3876433 (1975-04-01), Short
patent: 4054540 (1977-10-01), Michalchik
patent: 4102722 (1978-07-01), Shoop

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