Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – Including wiper
Reexamination Certificate
2006-09-12
2006-09-12
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
Including wiper
C101S127000, C101S169000, C015S245100, C015S236010
Reexamination Certificate
active
07104434
ABSTRACT:
Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elongated substantially parallel narrow sides spaced apart by a selected width. The elongated face sides and elongated narrow sides join together to form squeegee operating edges. The squeegee blade is free of mounting aperture as to provide four operating edges. The squeegee blade is mounted to a resilient clamping structure which applies a regular and controlled gripping force so as to avoid deformation of the squeegee blade edge due to excessive mounting force. The plurality of fasteners are received by the clamping structure for adjusting the gripping force to the squeegee blade.
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Panasonic, “Screen Printer SP20P-MA”, Instruction Manual—Maintenance, Section 2—Replacement of Parts, p. 2-2, Published by Create, no date avail.
Ribunal Jason Ronnie P.
Velasquez Eric P.
Brady III Wade James
Johnson Jonathan
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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