Screen printing process and apparatus and electrical printed cir

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427294, C23C 2600

Patent

active

049592467

ABSTRACT:
A process for providing through plated holes in a substrate by screen printing provides uniformly thick plating of the holes. One side of the substrate is screen plated while being subjected to an underpressure between 10 and 200 gr/cm.sup.2 from a chamber fed by a large volume vacuum vat. When treating the other side of the substrate, vacuum may be increased up to 2.5 times the first underpressure.

REFERENCES:
patent: 3357856 (1967-12-01), Ragan
patent: 4278706 (1981-07-01), Barry
patent: 4301192 (1981-11-01), Plichta
patent: 4323593 (1982-04-01), Tsunashima
patent: 4486738 (1984-12-01), Sadlo
Lau et al, "Vibrational Introduction of Fine Metallic Powder into Small Holes", IBM TDB, vol. 14, No. 9, Feb. 1972.

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