Screen printing on film coated substrates

Printing – Stenciling – Processes

Patent

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Details

427282, 4273831, 427384, B41C 112, B41C 134

Patent

active

056997337

ABSTRACT:
An improved method of screen printing is described wherein a double sided tape (dry film) is applied between the substrate and the screened-on paste. Since the dry film ensures the adhesion of the paste, no minimum thickness of paste is needed to attain good adhesion. By applying a thin layer of paste multiple times any thickness over a wide range can be obtained. Once the desired thickness of paste has been applied, the dry film is removed by firing in an oxidizing atmosphere. The method is applicable to, among others, phosphors, resistive materials, and conductive materials.

REFERENCES:
patent: 5250394 (1993-10-01), Wei
D.G. Keleman, "Dry Film Photoresists in Microelectronics" Solid State Technology, Aug. 1976, pp. 37-39.
H.M. Naguib et al, "A New Process for Printing Fine Conductor Lines and Spaces on Large Area Substrates", Solid State Technology, Oct. 1980, pp. 109-114.
Research Disclosure, "Low Distortion and Defect-Free Transfer of Prefabricated Circuits to Green Sheets", No. 30256, p. 433, Jun. 1989.

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