Screen printing method and apparatus therefor, and electronic co

Details Screen printing method and apparatus therefor, and electronic co Screen printing method and apparatus therefor, and electronic co

1997-05-15

2000-03-14

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 33, 228 42, 228219, 228261, 427 96, B23K 3512, B23K 100, B23K 3102, B05D 512

Patent

active

060360844

ABSTRACT:
Screen printing and chip mounting are executed in a dry air atmosphere to prevent generation of solder balls due to absorption of moisture by a flux ingredient of paste solder. Screen printing of the solder on a board takes place in a space which has the board, a printing screen and a squeegee arranged therein and is formed therein with a dry air atmosphere having a pressure slightly higher than that of an atmosphere outside the space. Likewise, mounting of a chip on the board is carried out in a like space. Also, a reflow step is executed in a reflow oven kept at a dry air atmosphere.

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