Screen-printing metal mask plate and method of resin-sealing...

Details Screen-printing metal mask plate and method of resin-sealing... Screen-printing metal mask plate and method of resin-sealing...

2006-04-11

2006-04-11

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S126000, C438S127000, C425S175000

Reexamination Certificate

active

07026180

ABSTRACT:
A squeegee is slid over a metal mask plate so as to fill a sealing resin in a resin inflow space through a through hole, and the sealing resin, deposited on an outer surface of an electronic part that includes a vibrating part, is thermally set. A through hole that corresponds to an electronic part is formed in a metal mask plate. The through hole includes a lower smaller through hole and an upper larger through hole communicating with an upper side of the lower smaller through hole, and a step portion is formed within the through hole. A relief recess is provided in a region of a metal mask plate including at least a projected region in which an operating area is projected onto a surface of the metal mask plate opposing the touch panel in a state in which the metal mask plate covers the touch panel.

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