Printing – Stenciling – Stencil and work support
Reexamination Certificate
2011-03-22
2011-03-22
Yan, Ren (Department: 2854)
Printing
Stenciling
Stencil and work support
C101S486000, C101SDIG036
Reexamination Certificate
active
07908964
ABSTRACT:
The clearance ‘d’ between a substrate3and a mask2can be reduced at the time of the position recognition by horizontally offsetting two recognition devices53,54for recognizing the substrate3and the mask2. Therefore, since the ascending stroke of the substrate3can be shortened at the time of the position alignment to contact the rear face of the substrate3with the rear face of the mask2, the position misalignment of the substrate in the horizontal direction caused by the raising is suppressed. Accordingly, it is possible to suppress the reduction of the position alignment accuracy with the mask2.
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Abe Seikou
Fukagawa Takahiro
Yamasaki Kimiyuki
Panasonic Corporation
Pearne & Gordon LLP
Yan Ren
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