Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1997-06-30
2000-02-01
Marquis, Melvyn I.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524701, 524787, 524786, 524796, 524404, 524428, C08K 300
Patent
active
060204249
ABSTRACT:
The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
REFERENCES:
patent: 383511 (1888-05-01), Ashcraft
patent: 2428608 (1947-10-01), Bass
patent: 3354123 (1967-11-01), Morgan
patent: 3882033 (1975-05-01), Wright
patent: 4001128 (1977-01-01), Penneck
patent: 5011870 (1991-04-01), Peterson
patent: 5011872 (1991-04-01), Latham et al.
patent: 5021494 (1991-06-01), Toya
patent: 5094769 (1992-03-01), Anderson, Jr. et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5572070 (1996-11-01), Ross
patent: 5708075 (1998-01-01), Chung et al.
Copy of U.S. Application Ser. No. 08/884,995 filed Jun. 30, 1997.
Mason Keith M.
Osuna Jesus E.
Stygar Vernon E.
Ferro Corporation
Marquis Melvyn I.
Milstead Mark W.
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