Scratch reduction in semiconductor circuit fabrication using che

Details Scratch reduction in semiconductor circuit fabrication using che Scratch reduction in semiconductor circuit fabrication using che

1997-03-12

1999-06-22

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451 57, 451 59, 451285, B24B 700

Patent

active

059137126

ABSTRACT:
A process for polishing a layer on a semiconductor wafer in which the incidence of undesirable scratches on the polished surface is reduced by using a multiple step polishing procedure. A relatively hard polishing pad is used first to planarize the wafer surface, using a chemically reactive and abrasive slurry. A second polishing step is then carried out on a relatively soft polishing pad, using a slurry to remove or reduce scratches introduced by polishing with the hard pad. A final polishing step is performed on the soft polishing pad using de-ionized water to remove particles from the surface of the wafer.

REFERENCES:
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 3673746 (1972-07-01), Highberg
patent: 3857123 (1974-12-01), Walsh
patent: 4016855 (1977-04-01), Mimata
patent: 4462188 (1984-07-01), Payne
patent: 4588421 (1986-05-01), Payne
patent: 5032203 (1991-07-01), Doy et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5302233 (1994-04-01), Kim et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5435772 (1995-07-01), Yu
patent: 5449314 (1995-09-01), Meikle et al.
patent: 5486265 (1996-01-01), Salugsugan
Sivaram, Srinivasan et al., "Developments in Consumables Used in the Chemical Mechanical Polishing of Dielectrics," International Conference on Solid State Devices & Materials, Aug. 21, 1995, (2 pages).
Ali, Iqbal et al., "Chemical-mechanical polishing of interlayer dielectric: A review," Solid State Technology, pp. 63-64, 66, 68, Oct. 1994.

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