Scrap-less taping system for IC lead-frames

Details Scrap-less taping system for IC lead-frames Scrap-less taping system for IC lead-frames

1985-09-03

1986-07-01

Thomas, Alexander S.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156270, 156301, 29827, 357 70, B32B 3108, B32B 3118

Patent

active

045978166

ABSTRACT:
A scrap-less taping system for IC lead-frames includes two tape supplies fed to a web of formed lead-frames. Right-angled segments of tape are cut from the strip of tape and applied to two adjacent sides of the leads of the lead-frames.

REFERENCES:
patent: 4480150 (1984-10-01), Jones et al.

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