Scrap-less taping system for IC lead-frames

Details Scrap-less taping system for IC lead-frames Scrap-less taping system for IC lead-frames

1986-02-24

1987-02-24

Thomas, Alexander S.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428 77, H01L 2348

Patent

active

046461272

ABSTRACT:
A scrap-less taping system for IC lead-frames includes two tape supplies fed to a web of formed lead-frames. Right-angled segments of tape are cut from the strip of tape and applied to two adjacent sides of the leads of the lead-frames.

REFERENCES:
patent: 4480150 (1984-10-01), Jones et al.

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