Scored polishing pad and methods related thereto

Abrading – Abrading process – Utilizing fluent abradant

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Details

451 41, 451 59, 451 63, B24B 100

Patent

active

060711787

ABSTRACT:
A polishing pad is provided comprising an upper surface and a lower surface, substantially parallel to one another, wherein the pad has enhanced flexibility produced by scoring of either or both surfaces. The pad thickness is generally greater than 500.mu.. The scoring creates slits having a depth of less than 90% of the thickness.

REFERENCES:
patent: 4111666 (1978-09-01), Kalbow
patent: 5177908 (1993-01-01), Tuttle
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5489233 (1996-02-01), Cook et al.
patent: 5876269 (1999-03-01), Torii

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