Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2004-03-05
2009-11-17
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S249000, C156S250000, C156S278000, C250S483100, C250S484400
Reexamination Certificate
active
07618511
ABSTRACT:
An auxiliary substrate20is overlapped onto a thin substrate11, and substrate11and auxiliary substrate20are covered with an organic film12. Thereafter, a scintillator13is formed on a scintillator forming portion12A of organic film12that corresponds to substrate11. Here, since thickness is added to substrate11by auxiliary substrate20, the warping of substrate11is prevented and scintillator13is formed uniformly.
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Sato Hiroto
Suganuma Masahiro
Suzuki Takaharu
Chan Sing P
Drinker Biddle & Reath LLP
Hamamatsu Photonics K.K.
Tucker Philip C
LandOfFree
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