Scintillator panel and method of manufacturing radiation...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S249000, C156S250000, C156S278000, C250S483100, C250S484400

Reexamination Certificate

active

07618511

ABSTRACT:
An auxiliary substrate20is overlapped onto a thin substrate11, and substrate11and auxiliary substrate20are covered with an organic film12. Thereafter, a scintillator13is formed on a scintillator forming portion12A of organic film12that corresponds to substrate11. Here, since thickness is added to substrate11by auxiliary substrate20, the warping of substrate11is prevented and scintillator13is formed uniformly.

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patent: WO 01/88567 (2001-11-01), None

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