Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including diode
Reexamination Certificate
2007-10-09
2007-10-09
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Including diode
C257SE21357, C257SE27040
Reexamination Certificate
active
11084471
ABSTRACT:
A Schottky diode capable of sustaining a breakdown voltage of greater than about 250 volts and a method for its manufacture. An epitaxial layer disposed on a semiconductor substrate has a thickness of at least about 15 micrometers and an impurity concentration ranging from about 1×1014atoms per cubic centimeter to about 1×1015atoms per cubic centimeter. A guard ring extends from about 3 micrometers to about 15 micrometers into the epitaxial layer. A dielectric material is formed over the epitaxial layer and a portion of the dielectric material is removed to expose a portion of the guard ring and a portion of the epitaxial layer within the guard ring. An electrically conductive material is formed over the exposed portion of the epitaxial layer and an electrically conductive material is formed in contact with a bottom surface of the semiconductor substrate.
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Duskin Mark
Kruse Blanca Estela
Dover Rennie W.
Geyer Scott B.
Semiconductor Components Industries L.L.C.
Ullah Elias
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