Schottky diode

Active solid-state devices (e.g. – transistors – solid-state diode – Schottky barrier – In integrated structure

Reexamination Certificate

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Details

C257S281000, C257SE29271, C438S167000

Reexamination Certificate

active

07915704

ABSTRACT:
Improved Schottky diodes (20) with reduced leakage current and improved breakdown voltage are provided by building a JFET (56) into the diode, serially located in the anode-cathode current path (32). The gates of the JFET (56) formed by doped regions (38, 40) placed above and below the diode's current path (32) are coupled to the anode (312) of the diode (20), and the current path (32) passes through the channel region (46) of the JFET (56). Operation is automatic so that as the reverse voltage increases, the JFET (56) channel region (46) pinches off, thereby limiting the leakage current and clamping the voltage across the Schottky junction (50) at a level below the Schottky junction (50) breakdown. Increased reverse voltage can be safely applied until the device eventually breaks down elsewhere. The impact on device area and area efficiency is minimal and the device can be built using a standard fabrication process so that it can be easily integrated into complex ICs.

REFERENCES:
patent: 4513309 (1985-04-01), Cricchi
patent: 5929502 (1999-07-01), Beasom
patent: 6423986 (2002-07-01), Zhao
patent: 7064407 (2006-06-01), Mallikarjunaswamy
patent: 7282386 (2007-10-01), Khemka et al.
patent: 7355260 (2008-04-01), Khemka et al.
patent: 7416929 (2008-08-01), Mazzola et al.
patent: 2002/0127787 (2002-09-01), Huang et al.
patent: 2008/0121895 (2008-05-01), Sheppard et al.
patent: 2010/0032731 (2010-02-01), Babcock et al.

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