Semiconductor device manufacturing: process – Forming schottky junction
Reexamination Certificate
2005-09-30
2008-03-11
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Forming schottky junction
C257SE21351
Reexamination Certificate
active
07341932
ABSTRACT:
Pt
−GaN Schottky barrier diodes are disclosed that are particularly suited to serve as ultra-violet sensors operating at wavelengths below 200 nm. The Pt
−GaN Schottky barrier diodes have very large active areas, up to 1 cm2, which exhibit extremely low leakage current at low reverse biases. Very large area Pt
−GaN Schottky diodes of sizes 0.25 cm2and 1 cm2have been fabricated from n−
+GaN epitaxial layers grown by vapor phase epitaxy on single crystal c-plane sapphire, which showed leakage currents of 14 pA and 2.7 nA, respectively for the 0.25 cm2and 1 cm2diodes both configured at a 0.5V reverse bias.
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Shahid Aslam et al., “Large Area Pt
-GaN Schottky barrier diode with extremely low leakage current”, EDL Manuscript No. 1698, May 20, 2003, pp. 1-3, USA.
Aslam Shahid
Franz David
Geyer Scott B.
The United States of America as represented by the Administrator
Ullah Elias
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