Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – Including wiper
Reexamination Certificate
2005-01-11
2005-01-11
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
Including wiper
Reexamination Certificate
active
06840425
ABSTRACT:
A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.
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Greenberg & Traurig, LLP
Stoner Kiley S.
TTM Advanced Circuits, Inc.
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