Scatterometry monitor in cluster process tool environment...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S095000, C700S096000, C700S108000, C700S109000, C700S110000, C700S120000, C702S033000, C702S035000, C702S040000, C702S155000, C702S168000, C702S182000, C356S611000, C356S394000, C356S625000, C356S636000, C438S795000

Reexamination Certificate

active

07076320

ABSTRACT:
Systems and methods that improve process control in semiconductor manufacturing are disclosed. According to an aspect of the invention, conditions in a cluster tool environment and/or a wafer therein can be monitored in-situ via, for example, a scatterometry system, to determine whether parameters associated with wafer production are within control limits. A cluster tool environment can include, for example, a lithography track, a stepper, a plasma etcher, a cleaning tool, a chemical bath, etc. If an out-of-control condition is detected, either associated with a tool in the cluster tool environment or with the wafer itself, compensatory measures can be taken to correct the out-of-control condition. The invention can further employ feedback/feed-forward loop(s) to facilitate compensatory action in order to improve process control.

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