Scanning system for rapid thermal cycle stress/curvature measure

Details Scanning system for rapid thermal cycle stress/curvature measure Scanning system for rapid thermal cycle stress/curvature measure

1997-08-08

2000-04-18

Westin, Edward P.

Radiant energy

Photocells; circuits and apparatus

With circuit for evaluating a web, strand, strip, or sheet

356376, 438 14, G01L 124, G01B 1100

Patent

active

060518448

ABSTRACT:
Accurate measurements of substrate surface curvature are effected by scanning the substrate in a scan direction along a diameter thereof and rotating it during rapid thermal processing (RTP). Rotation of the substrate also achieves more uniform heating of the substrate by exposing it uniformly to the radiant heat sources employed in the processing system. The heat sources are controllably energized in accordance with temperature measurements which provide feedback control for efficient and accurate cycling of the semiconductor wafer. Various methods are contemplated to effect the temperature measurement.

REFERENCES:
patent: 5270560 (1993-12-01), Cheng
patent: 5506672 (1996-04-01), Moslehi
patent: 5696383 (1997-12-01), Cheng
patent: 5848122 (1998-12-01), Kurtz

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