Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2006-08-01
2006-08-01
Rosenberger, Richard A. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
Reexamination Certificate
active
07084967
ABSTRACT:
A high sensitivity and high throughput surface inspection system directs a focused beam of light at a grazing angle towards the surface to be inspected. Relative motion is caused between the beam and the surface so that the beam scans a scan path covering substantially the entire surface and light scattered along the path is collected for detecting anamolies. The scan path comprises a plurality of arrays of straight scan path segments. The focused beam of light illuminates an area of the surface between 5–15 microns in width and this system is capable of inspecting in excess of about 40 wafers per hour for 150 millimeter diameter wafers (6-inch wafers), in excess of about 20 wafers per hour for 200 millimeter diameter wafers (8-inch wafers) and in excess of about 10 wafers per hour for 300 millimeter diameter wafers (12-inch wafers).
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R. Cast
Nikoonahad Mehrdad
Stokowski Stanley E.
KLA —Tencor Corporation
Parsons Hsue & de Runtz LLP
Rosenberger Richard A.
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