Scanning probe inspection apparatus

Details Scanning probe inspection apparatus Scanning probe inspection apparatus

2007-12-18

2007-12-18

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Of geophysical surface or subsurface in situ

Using electrode arrays, circuits, structure, or supports

C324S761010, C324S765010, C324S715000, C250S306000

Reexamination Certificate

active

10559773

ABSTRACT:
A pair of pads is formed on an insulating layer formed on a top surface of a substrate, and a plurality of through-holes is laid out at equal intervals between the pads. Adjoining through holes are connected alternately by upper-layer wire interconnect lines exposed on the insulating layer or lower-layer wire interconnect lines buried in the insulating layer, thus constituting a check pattern. A DC power supply is connected between the pair of pads, and a constant current is supplied to a chain pattern of the through holes. Two probes move on a chip surface along the chain pattern of the through holes while keeping a given interval spacing. The probes sequentially scan the upper-layer wire interconnect lines exposed through the chip surface of the chain pattern of the through-holes.

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