Measuring and testing – Surface and cutting edge testing – Roughness
Reexamination Certificate
2006-09-19
2006-09-19
Raevis, Robert (Department: 2856)
Measuring and testing
Surface and cutting edge testing
Roughness
Reexamination Certificate
active
07107826
ABSTRACT:
There is provided a device in which a probe can be used for both of observation and correction, and which can, even if a next generation photomask of ultra minute structure is made an object, perform a desired processing without injuring a normal portion in a process of obtaining information of a position and a shape of a defect part, and without impairing the probe also at a processing time. It has been adapted such that, at an observation time, a contact pressure between a probe and a mask is reduced to 0.1 nN by applying a vibration of 1 kHz to 1 MHz to the probe. It has been adapted such that a cantilever used in the present invention is formed by a silicon material of 100–600 μm in length and 5–50 μm in thickness and, at the observation time, the probe contacts with the mask at the contact pressure of 0.1 nN and, at the processing time, a defect correction can be performed by causing the probe to contact with the mask at the contact pressure of 10 nN to 1 mN.
REFERENCES:
patent: 5949070 (1999-09-01), Gamble
patent: 6075585 (2000-06-01), Minne et al.
patent: 6255469 (2001-07-01), Seeman et al.
patent: 6827979 (2004-12-01), Mirkin et al.
Takaoka Osamu
Watanabe Naoya
Adams & Wilks
Raevis Robert
SII NanoTechnology Inc.
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