Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1974-03-29
1976-01-20
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 357 50, 29580, B01J 1700
Patent
active
039329275
ABSTRACT:
There is disclosed a method of manufacturing the foregoing which comprises placing an epitaxial layer of a first conductivity type semiconductor material upon a substrate of semiconductor material having an intrinsic or semi insulating conductivity. Then channels are etched through the epitaxial layer to the semi insulating semiconductor substrate, thereby forming the epitaxial material into a plurality of parallel ribs or ridges. After coating the entire surface of the channels and the ridges with a dielectric layer, a conductive material is deposited over the substrate to fill the channels with the conductive material which may be either a metal or polycrystalline silicon doped to have sufficient conductivity. The surface of the substrate is then lapped to remove the conductive material and the dielectric material from the ridges to expose the first semiconductor material, and following diffusion of a dopant to convert the first semiconductor material to a second conductivity type material thereby forming a PN junction in each of the ridges in spaced locations therealong, suitable metallization is placed on the substrate to connect the first conductivity material to the conductive material in the channels to form column lines and metallization is placed on top a dielectric layer to connect the other conductivity material in a plurality of row lines.
REFERENCES:
patent: 3448344 (1969-06-01), Schuster
patent: 3500139 (1970-03-01), Frouin
patent: 3768150 (1973-10-01), Sloan
IBM Technical Disclosure Bulletin, Blum, Vol. 13, No. 9, Feb. 1971, p. 2494.
Coleman Michael G.
Grenon Lawrence A.
Motorola Inc.
Olsen Henry T.
Tupman W.
Weiss Harry M.
LandOfFree
Scannable light emitting diode array and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Scannable light emitting diode array and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Scannable light emitting diode array and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1689765