Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-11-20
2007-11-20
Tran, Long K. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257SE23069, C257SE23070
Reexamination Certificate
active
11283340
ABSTRACT:
A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each package substrate in the family includes a package substrate having a die side and a circuit board side. The package substrate has a size that is consistent for all of the package substrates in the family of package substrates. The die side has integrated circuit contacts disposed in a pattern designed to make electrical connections to a given integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit. The circuit board side has circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the package substrates in the family of package substrates.
REFERENCES:
patent: 6013877 (2000-01-01), Degani et al.
patent: 7112878 (2006-09-01), Akram
Hall Jeffrey A.
Miller Leah M.
LSI Corporation
Luedeka Neely & Graham P.C.
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