Scalable wide-array inkjet printhead and method for fabricating

Details Scalable wide-array inkjet printhead and method for fabricating Scalable wide-array inkjet printhead and method for fabricating

1997-10-28

2000-09-26

Barlow, John

Incremental printing of symbolic information

Ink jet

Ejector mechanism

347 42, B41J 2155, B41J 205

Patent

active

061234109

ABSTRACT:
A scalable wide-array printhead is formed by mounting multiple thermal inkjet printheads to a carrier substrate. The printheads are mounted to one face and logic ICs and drive ICs are mounted to an opposite face. Interconnects are formed through the carrier substrate to electrically couple the printheads to the logic ICs and drive ICs. The carrier substrate is formed of silicon and etched to define ink refill slots. A solder bump mounting process is used to mount the printheads to the carrier substrate. Such process serves to align each of the printheads. The solder forms a fluidic boundary around a printhead ink slot.

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