Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1995-07-20
1997-02-18
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, 439 67, H01R 909
Patent
active
056036191
ABSTRACT:
An apparatus for electrically connecting electrical contact pads on a first circuit board to electrical contact pads on a second circuit board is disclosed. Conductive bumps coupled to signal wires on a support element mate with the electrical contact pads on the first and second circuit boards. The mating provides an electrical connection allowing signals to be transmitted between the circuit boards. Alignment holes and alignment circuitry provide a means for verifying that the proper conductive bumps are mating with the proper electrical contact pads.
REFERENCES:
patent: 5226823 (1993-07-01), Johnson
patent: 5273439 (1993-12-01), Szeplip et al.
patent: 5309324 (1994-05-01), Hernandez et al.
patent: 5360347 (1994-11-01), Irlbeck et al.
Budelman Gerald A.
Trobough Mark B.
Turner Leonard O.
Intel Corporation
Nguyen Khiem
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