Scalable microelectronic package using conductive risers

Details Scalable microelectronic package using conductive risers Scalable microelectronic package using conductive risers

2006-12-05

2006-12-05

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23063, C257SE25023, C257S723000, C257S777000, C257S778000, C257S685000, C257S737000, C257S738000, C257S784000

Reexamination Certificate

active

07145226

ABSTRACT:
This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiting the number of signal and input/output leads. Specifically, an intermediate substrate having conductive risers therein is used to enable pitch control of the package to package interconnection, control of the standoff distance and act as a microelectronic package stiffener.

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