Scalable integrated circuit high density capacitors

Details Scalable integrated circuit high density capacitors Scalable integrated circuit high density capacitors

2007-08-21

2007-08-21

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S301100, C361S321200, C361S303000, C361S311000, C361S313000

Reexamination Certificate

active

11013789

ABSTRACT:
The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance.

REFERENCES:
patent: 5583359 (1996-12-01), Ng et al.
patent: 5872695 (1999-02-01), Fasano et al.
patent: 5939766 (1999-08-01), Stolmeijer et al.
patent: 6061228 (2000-05-01), Palmer et al.
patent: 6066537 (2000-05-01), Poh
patent: 6414835 (2002-07-01), Wolf et al.
patent: 6653681 (2003-11-01), Appel
patent: 6690570 (2004-02-01), Hajimiri et al.
patent: 6801422 (2004-10-01), Mosley
patent: 6933551 (2005-08-01), Stribley et al.
patent: 7009832 (2006-03-01), Chen et al.
patent: 7151660 (2006-12-01), Chen et al.
patent: 2003/0206389 (2003-11-01), Hajimiri et al.
patent: 2004/0031982 (2004-02-01), Devries et al.
Roberto Aparicio,Student Member, IEEE, and Ali Hajimiri,Member, IEEE; Capacity Limits and Matching Properties of Integrated Capacitors; IEEE Journal of Solid-State Circuits, pp. 384-393, vol. 37, No. 3, Mar. 2002.
Hirad Samavati,Student Member, IEEE, Ali Hajimiri, Arvin R. Shahani, Gitty N. Nasserbakht, and Thomas H. Lee,Member, IEEE; Fractal Capacitors; IEEE Journal of Solid-State Circuits, pp. 2035-2041, vol. 33, No. 12, Dec. 1998.
Jay Rajagopalan and Haris Basit; Optimization of Metal-Metal Comb-Capacitors for RF Applications, 4 pages, http://www.oea.com/document/Optimiz—Metal.pdf., Jan. 12, 2006.
Tirdad Sowlati, Vickram Vathulya and Domine Leenaerts; High Density Capacitance Structures in Submicron CMOS for Low Power RF Applications, ISLPED '01, Aug. 6-7, 2001, pp. 243-246.

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