Sawn power package and method of fabricating same

Details Sawn power package and method of fabricating same Sawn power package and method of fabricating same

2007-12-17

2008-12-30

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S692000, C438S110000, C438S111000, C438S112000

Reexamination Certificate

active

07470978

ABSTRACT:
In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be cingulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.

REFERENCES:
patent: 3574815 (1971-04-01), Segerson
patent: 4451973 (1984-06-01), Tateno et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6888228 (2005-05-01), Mostafazadeh et al.

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