Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-03-11
2008-03-11
Rose, Kiesha L. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S670000
Reexamination Certificate
active
07342297
ABSTRACT:
In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be singulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.
REFERENCES:
patent: 3574815 (1971-04-01), Segerson
patent: 4451973 (1984-06-01), Tateno et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6888228 (2005-05-01), Mostafazadeh et al.
Lim Peng Soon
Nadarajah Santhiran S O
Tan Eng Hwa
Beyer & Weaver, LLP
National Semiconductor Corporation
Rose Kiesha L.
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