Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool
Patent
1990-03-05
1991-07-09
Schmidt, Frederick R.
Abrasive tool making process, material, or composition
Impregnating or coating an abrasive tool
51235, B23C 100, B23Q 300
Patent
active
050294180
ABSTRACT:
A technique for sawing substrates on a chuck wherein the substrate is secured to a layer of a first sawing tape, and is placed on the major surface of a chuck with a second tape therebetween. The second tape comprises both a first major surface with a low surface tension effect that is in contact with the major surface of the chuck, and a multitude of perforations or pinholes therein. Vacuum is applied to both the channels in the major surface of the chuck and the pinholes in the second tape, to securely hole the substrate to the chuck during the sawing of the substrate. When the sawing is completed, the vacuum is removed and either atmospheric pressure or pressurized air is applied to the channels of the chuck, and the combination of the substrate, first sawing tape and second tape are easily removable because of the low surface tension effect of the first major surface of the second tape with the major surface of the chuck.
REFERENCES:
patent: 1945493 (1934-01-01), Martindell
patent: 2443987 (1948-06-01), Morrison et al.
patent: 2762954 (1956-09-01), Leifer
patent: 2970730 (1961-02-01), Schwarz
patent: 3040489 (1962-06-01), Da Costa
patent: 3206088 (1965-09-01), Meyer et al.
patent: 3461537 (1969-08-01), Lotz
patent: 3537169 (1970-11-01), Eigeman et al.
patent: 3562057 (1971-02-01), McAlister
patent: 3677875 (1972-07-01), Althouse
patent: 3711082 (1973-01-01), Seidenfaden
patent: 3729206 (1973-04-01), Cachon et al.
patent: 3766638 (1973-10-01), Moore
patent: 3918150 (1975-11-01), Gantley
patent: 3955163 (1976-05-01), Novak
patent: 4006909 (1977-02-01), Ollendorf et al.
patent: 4034517 (1977-07-01), Weatherell
patent: 4296542 (1981-10-01), Gotman
patent: 4506184 (1985-03-01), Siddall
patent: 4625463 (1986-12-01), Sekiya
patent: 4693036 (1987-09-01), Mori
patent: 4724222 (1988-02-01), Feldman
patent: 4808046 (1989-02-01), Pilkington
Eastman Kodak Company
Owens Raymond L.
Schmidt Frederick R.
Shideler Blynn
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