Saw strip for fixing a crystal and process for cutting off wafer

Details Saw strip for fixing a crystal and process for cutting off wafer Saw strip for fixing a crystal and process for cutting off wafer

1998-08-18

2000-03-14

Rachuba, M.

Stone working

Sawing

Reciprocating

836511, 83 14, 125 21, B28D 108

Patent

active

060358459

ABSTRACT:
A saw strip for fixing a crystal of semiconductor material when cutting wafers from this crystal using a wire saw, and a method for cutting wafers using the saw strip. The strip has a section adjoining the crystal that has a hardness which essentially corresponds to the hardness of the crystal. The saw strip may be a composite of several sections and/or may have a hollow cross section.

REFERENCES:
patent: 4655191 (1987-04-01), Wells et al.
patent: 4834062 (1989-05-01), Frank et al.
patent: 5377568 (1995-01-01), Hauser
patent: 5875769 (1999-03-01), Toyama et al.
patent: 5875770 (1999-03-01), Fukunaga
patent: 5893308 (1999-04-01), Katamachi et al.
patent: 5904136 (1999-05-01), Nagatsuka et al.
Patent Abstracts of Japan, vol. 097, No. 005, May 30, 1997, & JP 9-019921, an. 21, 1997.

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