Saw singulation

Details Saw singulation Saw singulation

2007-10-16

2007-10-16

Hail, III, Joseph J. (Department: 3723)

Stone working

Sawing

Rotary

C451S102000, C083S022000, C083S169000

Reexamination Certificate

active

11061126

ABSTRACT:
Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades.

REFERENCES:
patent: 3479097 (1969-11-01), McLauchlan et al.
patent: 3623520 (1971-11-01), Neild
patent: 3848929 (1974-11-01), Miller
patent: 4131267 (1978-12-01), Ono et al.
patent: 4521995 (1985-06-01), Sekiya
patent: 4625463 (1986-12-01), Sekiya
patent: 4652135 (1987-03-01), Ono
patent: 4672557 (1987-06-01), Tamura et al.
patent: 4688540 (1987-08-01), Ono
patent: 4696712 (1987-09-01), Nonaka
patent: 4715254 (1987-12-01), DeGan
patent: 4720635 (1988-01-01), Uga
patent: 4846623 (1989-07-01), Otani et al.
patent: 4872289 (1989-10-01), Yukawa et al.
patent: 5159866 (1992-11-01), Dunham
patent: 5331743 (1994-07-01), Lump
patent: 5761979 (1998-06-01), McGehee
patent: 5915370 (1999-06-01), Casper
patent: 6055694 (2000-05-01), Steere
patent: 6102023 (2000-08-01), Ishiwata et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6165232 (2000-12-01), Tieber et al.
patent: 6216682 (2001-04-01), Nambu et al.
patent: 6250990 (2001-06-01), Yoshii et al.
patent: 6277001 (2001-08-01), Saito
patent: 6286499 (2001-09-01), Yoshii et al.
patent: 6290274 (2001-09-01), Montoya
patent: 6295889 (2001-10-01), Jones
patent: 6341740 (2002-01-01), Sekiya et al.
patent: 6344402 (2002-02-01), Sekiya
patent: 6345616 (2002-02-01), Umahashi
patent: 6354285 (2002-03-01), Licht et al.
patent: 6361404 (2002-03-01), Ishiwata et al.
patent: 6371100 (2002-04-01), Sekiya
patent: 6381796 (2002-05-01), Sato
patent: 6382609 (2002-05-01), Namioka et al.
patent: 6386191 (2002-05-01), Yoshimura et al.
patent: 6448151 (2002-09-01), Tateishi
patent: 6465158 (2002-10-01), Sekiya
patent: 6483180 (2002-11-01), Bayan et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6494122 (2002-12-01), Kamigaki
patent: 6494197 (2002-12-01), Yoshimura et al.
patent: 6494775 (2002-12-01), Abrahamians et al.
patent: 6500047 (2002-12-01), Arai et al.
patent: 6500058 (2002-12-01), Bajo et al.
patent: 6568385 (2003-05-01), Sekiya et al.
patent: 6581586 (2003-06-01), Sekiya
patent: 6582287 (2003-06-01), Sasayama
patent: 6593170 (2003-07-01), Tateiwa et al.
patent: 6606985 (2003-08-01), Negishi
patent: 6705188 (2004-03-01), Gravely et al.
patent: 2002/0160695 (2002-10-01), Osada et al.
patent: 197 48 055 A 1 (1998-12-01), None
patent: 02/090075 (2002-11-01), None
European Patent Examination Report dated Mar. 19, 2007, from related Foreign Patent Application No. 05 723 354.6-2302. 3 pages.

Affiliated with

Also associated with

Rating

Saw singulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Saw singulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Saw singulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3893890