Stone working – Sawing – Rotary
Patent
1997-10-30
1999-06-29
Scherbel, David A.
Stone working
Sawing
Rotary
125 2302, 83578, B28D 104
Patent
active
059153709
ABSTRACT:
An apparatus for cutting a semiconductor wafer comprises a wafer holding assembly and a cutting assembly having at least one cutting element. The apparatus further comprises a control assembly coupled to the cutting assembly which is operable to move the cutting assembly in first and second generally opposed directions relative to a wafer held by the wafer holding assembly. The cutting assembly is further operable to engage the wafer as the cutting assembly is moved in both the first and second directions. A method of segmenting a semiconductor wafer comprises the steps of providing a reciprocating cutting assembly, the cutting assembly including at least one cutting element and reciprocates in first and second generally opposed directions. The cutting assembly engages the wafer as the cutting assembly moves in the first direction and as the cutting assembly moves in the second direction.
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Banks Derris H.
Micro)n Technology, Inc.
Scherbel David A.
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